The brand behind SpacemiT, which is dedicated to the innovation and development of high-performance RISC-V processor cores, high-performance chips, and core software systems, providing the industry with high-performance RISC-V processor chips and core software systems. This project involves the design of custom chip casing for SpacemiT's SpacemiT Key Stone? K1, the world's first 8-core RISC-V AI CPU chip, as well as exhibition packaging for new product launches and trade show applications.The exterior design of the chip casing is transparent, allowing for direct observation of the chip and facilitating its display during the product launch. The packaging design for the outer box has been simplified, making it easy for users to quickly open the package. The folding support mechanism of the box lid forms a small display stand, adding a special showcasing effect to the product.Taking inspiration from obsidian, one of the earliest tools created by humans, the design elements of the packaging underwent cutting and polishing, progress and iteration, transforming it into the most advanced tool of modern times: the chip. Through this process, symbolized by the chip, the progress of technology and the inheritance of wisdom are showcased to people. In the product packaging design, an irregular faceted appearance resembling obsidian is adopted.The overall design takes inspiration from the brand name "SpacemiT" and the product series name "Stone." Starting from the concept of "returning to the origin and moving towards the future," the design explores the fundamental material of the chip itself and seeks the cultural matrix, tracing the origins of technology, wisdom, and civilization. It delves into the fusion of human progress from basic manufacturing and tool usage to the storage and inheritance of knowledge.The packaging is custom-tailored based on the dimensions and shape of the chip. High-strength and abrasion-resistant acrylic composite materials are chosen to provide excellent protective performance, ensuring the stability and safety of the chip. Additionally, the use of anti-static materials and shock-absorbing materials helps prevent potential damage from static electricity and mechanical impacts on the chip.